Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz

imec's 300mm RF Silicon Interposer Platform for Chiplet-Based Heterogenous Integration Demonstrates Record-Low Insertion Loss at Frequencies up to 325GHz - Semiconductor Digest

At the IEEE ECTC 2025 conference, imec highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.

Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz

LEUVEN (Belgium), MAY 27, 2025 — At the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform. The platform enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a single carrier, achieving a record-low insertion loss of just 0.73dB/mm at frequencies up to 325G…