US EditionWeekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap
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Weekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap
These are the most-read DIGITIMES Asia stories from the week of May 19 – May 25. Highlights include China's accelerating push for tech self-sufficiency with new AI chips and operating systems, TSMC's global fab and packaging expansion gaps, Wolfspeed's looming bankruptcy amid China's SiC surge, and Huawei's growing dominance in 5G infrastructure as Western RAN giants retreat. From Computex showdowns to DeepSeek's LLM momentum, here's what topped…
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