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Published Manchester, United KingdomUpdated

2D Graphene Interconnects for CMOS and Integrated Circuits

Summary by kalkinemedia.com
Inventor Bellezza Has Several US Patents for Fusing Circuits Using Low Temperatures Within The Thermo Budget of CMOS Chips, It is a Single Step Process. PARKESBURG, PA, UNITED STATES, March 20, 2025 /EINPresswire.com/ -- Anthony Paul Bellezza has pioneered a novel 2D Graphene fusion process for semiconductor assembly, operating at low temperatures, which holds the potential to revolutionize CMOS chip manufacturing. This innovative process addres…
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manchester.ac.uk broke the news in on Thursday, March 20, 2025.
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