Intel's Advanced Packaging for Bigger AI Chips

Intel's Advanced Packaging for Bigger AI Chips

This week at the IEEE Electronic Components and Packaging Technology Conference, Intel unveiled that it is developing new chip packaging technology that will allow for bigger processors for AI.With Moore’s Law slowing down, makers of advanced GPUs and other data center chips are having to add more silicon area to their products to keep up with the relentless rise of AI’s computing needs. But the maximum size of a single silicon chip is fixed at …