US EditionInfineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK Package Enable Higher Power Density for Industrial Applications
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Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications | IoT Now News & Reports
Infineon Technologies AG has launched the CoolSiC MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency and power density. They The post Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications appeared first on IoT Now News - How to run an IoT enabled business.
Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications
By Marion Webber Infineon Technologies AG has launched the CoolSiC MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency and power density. They The post Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications appeared first on IoT Now News – How to run an IoT enabled business. Read more here:: www.m2mnow.biz/f…
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