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Neubiberg · NeubibergBy Marion Webber Infineon Technologies AG has launched the CoolSiC MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency and power density. They The post Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications appeared first on IoT Now News – How to run an IoT enabled business. Read more here:: www.m2mnow.biz/f…See the Story
Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK Package Enable Higher Power Density for Industrial Applications

Artificial Intelligence · AustraliaF5, Inc. announced an expanded strategic partnership with MinIO, Inc. The partnership delivers a solution designed to address the needs of modern data-intensive AI workloads, particularly those that require AI factories for advanced inference and training use cases where data is collected globally from distributed endpoints, edge environments, data centers, and cloud infrastructures. By joining […] The post F5 and MinIO Expand Strategic Partners…See the Story