GlobalFoundries to make key AI chip component for TSMC

GlobalFoundries to make key AI chip component for TSMC

Oct 8 : GlobalFoundries on Thursday said it would make a key component used to link AI processors and memory chips for TSMC at its New York facility.Known as a silicon interposer, the component sits beneath processors and memory chips inside advanced AI packages and enables them to communicate at high speeds

GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging

Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing...

GlobalFoundries signs five-year silicon interposer deal with TSMC

GlobalFoundries signs a five-year silicon interposer deal with TSMC, with volume production expected to ramp in the first half of 2028.