US EditionWhy this key chip technology is crucial to the AI race between the US and China
- Nvidia CEO Jensen Huang emphasized last month at Computex in Taipei that advanced packaging is crucial for AI chip performance.
- This focus stems from the rising demand for complex AI computing and the challenges of costly chip fabrication and US-China trade tensions.
- Taiwan Semiconductor Manufacturing Company announced a $100 billion investment to build two advanced packaging facilities in Arizona, marking the largest foreign investment in US history.
- Huang noted in January that advanced packaging capacity has quadrupled in under two years, while analysts highlight that US facilities will boost domestic AI chip production.
- This expansion suggests strengthened US semiconductor capabilities essential for AI applications, while Taiwan remains attentive to the global impact of this shift.
13 Articles
13 Articles
Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most powerful company” according to US President Donald Trump, unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.
TSMC adjusts global growth plans as Washington ramps up demands
TSMC, under growing pressure from Washington to accelerate its American operations, is reconsidering its global capacity expansion plans. While it moves rapidly to scale up production in the US, sources within its supply chain confirm that plans for new fabs in Japan and Germany are being adjusted amid weakening global auto demand and rising geopolitical and economic uncertainty.
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