TSMC Reiterates It Doesn't Need High-NA EUV for 1.4nm-Class Process Technology

TSMC reiterates it doesn't need High-NA EUV for 1.4nm-class process technology

TSMC reaffirmed that it will not use High-NA EUV lithography for its upcoming A16 and A14 process technologies, as Low-NA EUV tools combined with internal innovations provide sufficient scaling and performance benefits.

TSMC is Undecided If It Wants To Make a Jump Towards ASML’s $400 Million NA Machines, With The Company Saying That Its Current Hardware Can Pursue 1.4nm Wafer Production

Transitioning to cutting-edge lithography requires highly advanced EUV machines that will allow TSMC to rapidly manufacture 2nm wafers with a minimum number of ‘bad’ batches. The company started accepting orders for the aforementioned manufacturing process earlier this year, with MediaTek announcing that it will commence tape-out of its first 2nm chipset by Q4 2025. However, going beyond this limit and entering the sub-2nm realm will require som…