US EditionTeledyne FLIR OEM Introduces Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025
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Teledyne FLIR OEM Introduces Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025
New kit combines hardware and software to accelerate AI integration for defense, security, and industrial applications Teledyne FLIR OEM has launched the Boson®+ IQ Development Kit, a new solution designed to speed up the integration of thermal imaging and artificial intelligence (AI) at the edge. The announcement was made ahead of DSEI UK 2025, one […] The post Teledyne FLIR OEM Introduces Boson+ IQ Thermal Imaging Development Kit at DSEI UK 20…
Teledyne launches Boson+ IQ Development Kit - RotorHub International
Teledyne FLIR OEM has launched the Boson+ IQ Development Kit, which combines reference hardware with Prism software to develop edge AI capabilities using advanced thermal sensing. The kit includes interface and carrier boards with three MIPI interfaces, Boson+ and Pris SDKs, hardware interface control documentation (ICD), and engineering support. It is future proofed to be compatible with upcoming additions, such as Prism SKR and Prism Superviso…
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