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TechInsights performs teardown on NVIDIA Blackwell HGX B200 Platform - Electronic Products & Technology

Summary by Electronic Products & Technology
TechInsights has released its early-stage findings of its teardown analysis of the NVIDIA Blackwell HGX B200 platform delivering advanced artificial intelligence (AI) and high-performance computing (HPC) performance in the data center. TechInsights reports SK hynix is the high-bandwidth memory (HBM3E) supplier and the GB100 graphics processing unit (GPU) implements TSMC’s latest advanced packaging architecture. “Our analysts, technicians, and en…

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Semiconductor Digest broke the news in on Monday, April 14, 2025.
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