Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes

Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes

Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies

Can You Build A Known-Good Multi-Die System?

Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of …

Synopsys, Samsung collaborate on advanced AI and HPC designs

Synopsys, Inc. announced its ongoing close collaboration with Samsung Foundry to power the next generation of designs for advanced edge AI, HPC, and AI applications. The collaboration between the companies is helping mutual customers achieve successful tape-outs of their complex designs using Synopsys’ 3DIC Compiler and Samsung’s advanced packaging technologies with fast turnaround time. Mutual customers can improve power, performance and area (…