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[Opinion] Hanmi Semiconductor Says Hybrid Bonders Too Costly for HBM4, HBM5 Production

Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company defends its market-leading position against rising competition.Opinion · South Korea See the Story

Semiconductor Value Chain With A Focus On IP Providers

By Global Semiconductor Alliance (GSA) The semiconductor industry operates within a complex and rapidly evolving ecosystem driven by continuous innovation. Central to this ecosystem is the semiconductor value chain, which includes several key stages: chip design, wafer fabrication, final assembly, and raw material sourcing. Each stage is crucial to the production and functionality of semiconductor devices. In conjunction with the Global Semicond…Read Article

Report: The AI Efficiency Boom

Artificial Intelligence (AI) is undergoing a fundamental transformation. While early AI models were large, compute-heavy, and dependent on cloud processing, a new wave of efficiency-driven innovations is moving AI inference—the generation of model results—to the edge. Smaller models, improved memory and compute performance, and the need for privacy, low latency, and energy efficiency are driving AI adoption in mobile devices, wearables, robotics…Artificial Intelligence Read Article

Silicon IP Revenue Spikes

EDA and silicon IP revenue grew 12.8% in Q1 2025, totaling $5.098 billion compared to $4.522 billion in the same period last year, but the real story was on the IP side. surging 29.6% year-over-year to $1.577 billion. Drilling deeper into those numbers, revenue for non-reporting IP companies — predominantly Arm — jumped 34.1% YoY to $1.031 billion. That was positive news for the IP market, and it reinforced predictions of strong growth in a mult…China · China Read Article

Analysis of RISC-V CPU Fuzzers via Automatic Bug Injection (ETH Zurich)

A new technical paper titled “Encarsia: Evaluating CPU Fuzzers via Automatic Bug Injection” was published by researchers at ETH Zurich. Abstract “Hardware fuzzing has recently gained momentum with many discovered bugs in open-source RISC-V CPU designs. Comparing the effectiveness of different hardware fuzzers, however, remains a challenge: each fuzzer optimizes for a different metric and is demonstrated on different CPU designs. Furthermore, the…Zurich · Zurich Read Article

Physics-Based ASICs (Normal Computing Et Al.) - Data Intelligence

A new technical paper titled “Solving the compute crisis with physics-based ASICs” was published by researchers at Normal Computing Corporation, ARIA, UC Santa Barbara, University of Pennsylvania, Santa Fe Institute, Cornell University. Advanced Research Projects Agency – Energy and Yale University. Abstract“Escalating artificial intelligence (AI) demands expose a critical “compute crisis” characterized by unsustainable energy consumption, prohi…Artificial Intelligence · Santa Barbara See the Story

Three Methods For Improving Planarization For Diverse Layouts In Advanced Nodes (Fraunhofer IPMS) - Data Intelligence

A new technical paper titled “Reduced Topography After Stop on Nitride (SON) STI CMP Through Improved Post-Bulk Planarity for Diverse Layouts in Advanced Nodes” was published by researchers at Fraunhofer IPMS. Abstract“Three methods for improving planarization in a ceria free, two step STI CMP process were investigated using patterned test wafers representing 2X nm technology. It was found that within die non-uniformity (WIDNU) after bulk CMP ca…Dresden, Sachsen · Dresden See the Story

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[Opinion] Hanmi Semiconductor Says Hybrid Bonders Too Costly for HBM4, HBM5 Production

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Analysis of RISC-V CPU Fuzzers via Automatic Bug Injection (ETH Zurich)

Physics-Based ASICs (Normal Computing Et Al.) - Data Intelligence

Three Methods For Improving Planarization For Diverse Layouts In Advanced Nodes (Fraunhofer IPMS) - Data Intelligence

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