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We’ve discovered 294 headlines written by Semiconductor Engineering during the past 3 months.

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Top Semiconductor Engineering News

Wisconsin Politics · Madison

Wisconsin Supreme Court Delivers Win for Environmentalists in Fight over ‘Forever Chemicals’

58% Center coverage: 43 sources

See the Story

US Economy · Texas

Texas Instruments to Invest More than $60 Billion to Make Semiconductors in the US

62% Center coverage: 40 sources

See the Story

Donald Trump · United States

Micron Boosts US Investment Plan by $30 Billion Amid Trump’s Onshoring Push

69% Center coverage: 26 sources

The Commerce Department said Thursday that Micron Technology Inc. plans to invest $200 billion in semiconductor manufacturing in the United States.See the Story

Blindspots

Blindspot:

56 sources

Wisconsin Supreme Court Delivers Win for Environmentalists in Fight over ‘Forever Chemicals’

Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes

100% Center coverage: 6 sources

Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced TechnologiesArtificial Intelligence · Sunnyvale See the Story

EDA's Top Execs Map Out An AI-Driven Future - Data Intelligence

Artificial intelligence is permeating the entire semiconductor ecosystem, forcing fundamental changes in AI chips, the design tools used to create them, and the methodologies used to ensure they will work reliably. This is a global race that will redefine nearly every domain over the next decade. In presentations and interviews over the past several months, top EDA executives converged on three major trends that will become focal points for the …Artificial Intelligence · San Jose See the Story

Device Architecture For 2D Material-Based mNS-FETs In Sub-1nm Nodes (Sungkyunkwan Univ., Alsemy)

A new technical paper titled “Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes” was published by researchers at Sungkyunkwan University and Alsemy Inc. “This paper explores the design and optimization of multi-Nanosheet Field-Effect Transistors (mNS-FETs) employing a Transition Metal Dichalcogenide (TMDC) channel, specifically MoS2, for the 0.7 nm technology node using calibrated Technology Computer-Aided Design (TCAD)…Gyeonggi-Do · Gyeonggi-Do Read Article

Platform for LN-Based Wavelength-Scale Integrated Phononic Waveguides On Diamond (Stanford, UCSB)

A new technical paper titled “Integrated phononic waveguide on thin-film lithium niobate on diamond” was published by researchers at Stanford University and UC Santa Barbara. Abstract “We demonstrate wavelength-scale phononic waveguides formed by transfer-printed thin-film lithium niobate (LN) on bulk diamond (LNOD), a material stack that combines the strong piezoelectricity of LN with the high acoustic velocity and color-center compatibility of…Stanford · Stanford Read Article

Research Bits: June 24

In-sensor visual processing Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can both capture and process visual data in the analog domain to reduce the latency between sensing and identification. The team created two integrated arrays of gate-tunable silicon photodetectors that share bipolar analog output and low-power operation, enabling one array to capture dynamic visual i…Amherst, Massachusetts · Amherst Read Article

3d stacked integration for DRAM and processors

Institute of Science Tokyo revealed advances to its BBCube 3D integration process at ECTC, the IEEE Electronic Components and Technology Conference. “These new technologies can help in addressing the demands ... The post 3d stacked integration for DRAM and processors appeared first on Electronics Weekly.Tokyo, Japan · Tokyo See the Story

Machine Intelligence on Wireless Edge Networks with RF Analog Architecture (MIT, Duke)

arXiv preprint arXiv:2506.12210 (2025). Tags: analog deep neural network DNN Duke University edge computing edge devices low power memory-free MIT RF ...http://dlvr.it/TLTnYnCambridge, Massachusetts · Cambridge See the Story

Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing (Infineon, U. Padova et al.)

A new technical paper titled “Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing” was published by researchers at Infineon Technologies, University of Padova and University of Bologna. Abstract “In the semiconductor sector, due to high demand but also strong and increasing competition, time to market and quality are key factors in securing significant market share in various application areas. Thanks to the succ…Veneto · Veneto Read Article

News from Semiconductor Engineering

News from Semiconductor Engineering

Information about Semiconductor Engineering

Media Bias Ratings

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Ownership

Top Semiconductor Engineering News

Wisconsin Supreme Court Delivers Win for Environmentalists in Fight over ‘Forever Chemicals’

Texas Instruments to Invest More than $60 Billion to Make Semiconductors in the US

Micron Boosts US Investment Plan by $30 Billion Amid Trump’s Onshoring Push

Blindspots

Wisconsin Supreme Court Delivers Win for Environmentalists in Fight over ‘Forever Chemicals’

Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes

EDA's Top Execs Map Out An AI-Driven Future - Data Intelligence

Device Architecture For 2D Material-Based mNS-FETs In Sub-1nm Nodes (Sungkyunkwan Univ., Alsemy)

Platform for LN-Based Wavelength-Scale Integrated Phononic Waveguides On Diamond (Stanford, UCSB)

Research Bits: June 24

3d stacked integration for DRAM and processors

Machine Intelligence on Wireless Edge Networks with RF Analog Architecture (MIT, Duke)

Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing (Infineon, U. Padova et al.)

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