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Roadmap for AI HW Development, With The Role of Photonic Chips In Supporting Future LLMs (CUHK, NUS, UIUC, Berkeley)

Summary by Semiconductor Engineering
A new technical paper titled “What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips” was published by researchers at The Chinese University of Hong Kong, National University of Singapore, University of Illinois Urbana-Champaign and UC Berkeley. Abstract “Large language models (LLMs) are rapidly pushing the limits of contemporary computing hardware. For example, training GPT-3 has been estimated to consume around 1300 …
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Semiconductor Engineering broke the news in on Sunday, June 1, 2025.
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