Powertech to Invest in Venture with Broadcom

Powertech to invest in venture with Broadcom

Powertech Technology Inc (力成科技), a provider of memory and logic chip packaging services, on Thursday said it plans to invest US$400 million to create a new joint venture with Broadcom Inc in Singapore to cater to customer demand for advanced panel-based packaging services.The joint venture would con

Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom in Singapore to build panel-level advanced packaging (PLP) manufacturing capacity, with the planned investment totaling US$400 million.