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Optimal Surface Condition For Improved Cu-to-Cu Direct Bonding (NCHU, Osaka Univ.)
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Optimal Surface Condition For Improved Cu-to-Cu Direct Bonding (NCHU, Osaka Univ.)
A new technical paper titled “Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding” was published by researchers at National Chung Hsing University (NCHU) and Osaka University. Abstract excerpt “Three-dimensional integrated circuits (3D IC) require low-temperature, high-reliability Cu–Cu direct bonding to support fine-pitch vertical interconnects and heterogeneous integration. This study developed a hybrid surface pretreat…
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