Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports
Nvidia is pushing suppliers to standardize NVHBM parts, and Samsung plans to keep making standard HBM and custom chips in-house.
- On Sunday, the Seoul Economic Daily reported that Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory chips.
- This collaboration marks the first time Samsung has worked with the Taiwanese contract chipmaker at the HBM manufacturing stage, as Nvidia seeks to standardize implementation across multiple memory suppliers via custom controllers.
- Nvidia reportedly asked Samsung, SK Hynix, and Micron Technology to adopt TSMC's process for NVHBM base dies and sixth-generation DRAM technology for core dies, according to industry sources cited by the Seoul Economic Daily.
- After an internal review, Samsung accepted Nvidia's requirements but plans to retain its in-house production model for standard HBM and custom products for other customers.
- If demand exceeds TSMC's capacity, Samsung is evaluating whether its own foundry could produce NVHBM base dies, according to an unnamed source cited by the Seoul Economic Daily.
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Nvidia reportedly asks Samsung, SK Hynix, Micron to use TSMC 3nm
Samsung Electronics will make a core part of Nvidia’s custom memory chips on TSMC’s 3-nanometre process. The Seoul Economic Daily reported the move on Sunday, citing industry sources. It would be the first time the two have worked together on making high-bandwidth memory (HBM). The part is the base die, the logic layer at the […] This story continues at The Next Web
Samsung to use TSMC technology for Nvidia's next-generation memory chips
Samsung is set to use TSMC's 3-nanometre process to manufacture base dies for Nvidia’s next-generation custom high-bandwidth memory chips, according to a Seoul newspaper report. The move links Samsung’s memory packaging role with TSMC’s advanced...
Samsung to use TSMC's 3nm process for Nvidia's next-gen AI memory chips
Samsung Electronics is set to use TSMC's 3-nanometre manufacturing process to produce the base dies for Nvidia's next-generation custom high-bandwidth memory chips.Acording to a report by the Seoul...
Samsung to use TSMC technology for Nvidia's next-generation memory chips: Report
Nvidia has asked Samsung, SK Hynix and Micron Technology to use TSMC's process for NVHBM base dies, and sixth-generation DRAM technology for its core dies, the newspaper said, citing industry sources.
Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports
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