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AMD Ryzen AI "Medusa Point" APU Could Arrive with Larger Footprint - BGA "FP10" Dimensions Leaked

Summary by techpowerup.com
Shipping manifests have served as fairly reliable sources of pre-launch information—Everest (aka Olrak29) has discovered many juicy details in recent times. Their latest sleuthing session—combing through NBD documents—has indicated AMD's (alleged) prepping of a larger socket design for next-generation mobile processors. A leaked document alludes to the existence of various "MEDUSA01" jig and block "FP10" socket validation parts. Current-generati…
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Guru3D.comGuru3D.com

AMD Ryzen AI Medusa Point: Chiplet Design and Enlarged Socket

Looking at the latest shipping docs, it appears that AMD’s new Medusa Point APU might feature a chiplet-based design. Early information shows a 12-core Zen 6 module built on TSMC’s 3 nm process, paired with a separate mobile client I/O die made using the N4P process.

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techpowerup.comtechpowerup.com

AMD Ryzen AI "Medusa Point" APU Could Arrive with Larger Footprint - BGA "FP10" Dimensions Leaked

Shipping manifests have served as fairly reliable sources of pre-launch information—Everest (aka Olrak29) has discovered many juicy details in recent times. Their latest sleuthing session—combing through NBD documents—has indicated AMD's (alleged) prepping of a larger socket design for next-generation mobile processors. A leaked document alludes to the existence of various "MEDUSA01" jig and block "FP10" socket validation parts. Current-generati…

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techpowerup.com broke the news in on Thursday, March 27, 2025.
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