US EditionAIchip goes all in on CoWoS advanced packaging
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AIchip goes all in on CoWoS advanced packaging
Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced packaging business development at Taiwan Semiconductor Manufacturing Company (TSMC), was elected as a new independent director. Amid AIchip's push to develop CoWoS advanced packaging technology in recent years, the election is expected to strengthen its cooperative r…
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