US EditionAddressing Stress In Heterogeneous 3D-IC Designs
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Addressing Stress In Heterogeneous 3D-IC Designs
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new challenges that must be carefully navigated. As chip designers integrate multiple dies and technologies into a single 3D package, the interactions between the chip and package become increasingly complex and critical to overall device functionality. Compa…
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