Micron Technology, Inc. Ships HBM4 36GB Samples, Enhancing Memory Performance for Next-Gen AI Applications

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Micron Technology, Inc. Ships HBM4 36GB Samples, Enhancing Memory Performance for Next-Gen AI Applications

Micron announces HBM4 36GB shipment, enhancing AI performance and power efficiency, supporting growing data center demands.

Micron ships HBM4 samples to key customers, targets 2026 ramp up

According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is built on Micron's 1-beta DRAM process and features a 2048-bit interface capable of exceeding 2.0 TB/s per stack — more than a 60% performance improvement over its predecessor.

Micron ships HBM4 to key customers, targets solid market share in 2025

As data centers face increasing demands for AI training and inference workloads, high-bandwidth memory (HBM) has become a critical competitive edge for memory manufacturers. Micron announced that its 12-layer stacked 36GB HBM4 samples have been delivered to multiple major customers. Utilizing the 1β DRAM process technology, mass production is expected to begin in 2026 to support customer growth on next-generation AI platforms.

Micron starts to ship samples of HBM4 memory to clients — 36 GB capacity and bandwidth of 2 TB/s

Micron has become the first DRAM vendor to begin sampling 36GB HBM4 memory with a 2048-bit interface and 2TB/s bandwidth.