TSMC Etches First 2 Nm Silicon at Fab 22 as Volume Production Nears

TSMC Fab 22 Achieves First 2 nm Wafer Exposure Milestone

TSMC has reached a major breakthrough in its chip manufacturing roadmap: the company just etched its first 2 nm wafer at Fab 22 in Kaohsiung, Taiwan. This event marks the official start of N2 process testing, moving TSMC one step closer to full-scale production by late 2025.

TSMC Etches First 2 nm Silicon at Fab 22 as Volume Production Nears

TSMC has achieved a significant milestone with the first wafer exposure using its N2 process technology at the Kaohsiung Fab 22 facility. This sets the stage for volume manufacturing by late 2025. The accomplishment demonstrates readiness to deliver next-generation semiconductors as Phase 1 nears completion and Phase 2 equipment installation progresses following its groundbreaking in August. Initially planned in 2021 for mature node production a…