TSMC to Open Munich Design Centre in Q3 to Support Advanced Chip Design for Europe · TechNode
- TSMC revealed plans to establish its inaugural European facility focused on chip design in Munich, scheduled to open by mid-2025, aiming to enhance advanced semiconductor development within the region.
- This move follows Europe's strategy to enhance technological autonomy amid rising global trade tensions and the EU's push for semiconductor self-reliance.
- The Munich center will focus on high-density, high-performance, and energy-efficient chips for automotive, industrial, AI, and Internet-of-Things applications.
- Paul de Bot, who leads TSMC Europe, explained that the new center aims to help customers across Europe develop chips characterized by high density, strong performance, and energy efficiency, targeting sectors such as automotive, industrial, AI, and IoT.
- The opening expands TSMC’s global design network and supports Europe’s semiconductor ecosystem, complementing a €10 billion joint manufacturing venture in Dresden.
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TSMC to open Munich Design Centre in Q3 to support advanced chip design for Europe · TechNode
At TSMC’s 2025 Europe Technology Symposium, Paul de Bot, General Manager of the European Semiconductor Manufacturing Company (ESMC), announced that TSMC’s Munich Design Centre will be launched in the third quarter. The Munich Design Centre is intended to support chip design customers served by the ESMC fab. “This is to help European customers design high-density, high-performance, and energy-efficient chips, with a continued focus on automotive,…
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