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TSMC to Open Munich Design Centre in Q3 to Support Advanced Chip Design for Europe · TechNode

  • TSMC revealed plans to establish its inaugural European facility focused on chip design in Munich, scheduled to open by mid-2025, aiming to enhance advanced semiconductor development within the region.
  • This move follows Europe's strategy to enhance technological autonomy amid rising global trade tensions and the EU's push for semiconductor self-reliance.
  • The Munich center will focus on high-density, high-performance, and energy-efficient chips for automotive, industrial, AI, and Internet-of-Things applications.
  • Paul de Bot, who leads TSMC Europe, explained that the new center aims to help customers across Europe develop chips characterized by high density, strong performance, and energy efficiency, targeting sectors such as automotive, industrial, AI, and IoT.
  • The opening expands TSMC’s global design network and supports Europe’s semiconductor ecosystem, complementing a €10 billion joint manufacturing venture in Dresden.
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Sustainable Truck&Van broke the news in on Tuesday, May 27, 2025.
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