Tesla Dojo 3 Will Be 2 Nanometer Chips Supplied by Samsung with Intel Packaging

Intel Wins Tesla Dojo 3 Packaging Contract in Dual-Supplier Strategy

Intel has secured Tesla as a customer for its specialized module-level packaging services, signaling that billions of investments and years of development are appealing to external Foundry Customers. Tesla's Dojo 3 initiative will see Samsung Electronics Foundry manufacture the custom D3 AI-training chips. At the same time, Intel handles the packaging and testing using its Embedded Multi-Die Interconnect Bridge (EMIB) technology, which connects …

Tesla is Reportedly Opting for Packaging Services from Intel Foundry for Its Dojo Supercomputer, Getting the Chip Industry 'Underdogs' into Its Supply Chain

After Samsung Foundry, Intel has managed to win an order for Tesla's supercomputers, as the company will now be responsible for packaging and testing. Intel's EMIB Technology Acts as a Viable Alternative to TSMC's SoW, With Higher Modularity It seems like Elon Musk's Tesla is actually looking to pivot away from TSMC by diversifying its sources for different products. Recently, we reported on how the automaker managed to secure a huge contract wi…

Tesla Dojo 3 Will Be 2 Nanometer Chips Supplied by Samsung with Intel Packaging

Tesla plans to split Dojo 3 chip production, with Samsung handling front-end manufacturing and Intel taking on specialized packaging. This is a move away from TSMC’s full-process control. Samsung’s foundry to produce D3 chips will use the 2nm process for Tesla’s AI6 and Dojo 3. Intel will use leverage EMIB 2.5D packaging for Dojo’s large-scale ...