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Siemens, TSMC push chip design envelope
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Siemens, TSMC push chip design envelope
Siemens Digital Industries Software readied an automated workflow for Taiwan Semiconductor Manufacturing Corp’s (TSMC) high-performance wafers used in mobile and other computing applications, advancing an existing collaboration. The workflow was developed for TSMC’s InFO packaging technology, an integration method which delivers high-density interconnection and performance in silicon in 2D or 3D arrangements. Siemens employed its Innovator 3D IC…
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