Samsung Electronics Says It Has Shipped HBM4 Chips to Customers
Samsung's HBM4 offers 46% faster speeds than industry standard and 40% improved power efficiency, aiming to meet surging AI data center demand and expand market share.
- From Seoul, Samsung said it began mass producing and shipped HBM4 to unnamed customers on Feb 12, 2026.
- Demand from AI data centers has prompted Samsung to pursue faster, higher-capacity HBM solutions as customers' performance needs rise, with Samsung expecting HBM sales to more than triple in 2026.
- Samsung said HBM4 achieves a consistent 11.7 Gbps, up to 13 Gbps, boosts 3.3 TB/s bandwidth per stack, offers 24 GB–36 GB via 12-layer stacking, and improves power efficiency by 40%.
- Samsung Electronics Co., Ltd. shares rose 6.4% on Friday after the HBM4 launch, while rivals signalled ongoing high-volume production and partnership expansion plans.
- Samsung plans to deliver HBM4E samples in the second half of this year, using advanced 1c DRAM and 4nm logic process to secure stable yields and improve scaling.
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Samsung says it sent the first commercial HBM4 shipments to customers, as it seeks to supply Nvidia and compete with memory rivals like SK Hynix and Micron (Yoolim Lee/Bloomberg)
Yoolim Lee / Bloomberg: Samsung says it sent the first commercial HBM4 shipments to customers, as it seeks to supply Nvidia and compete with memory rivals like SK Hynix and Micron — Samsung Electronics Co. claimed an early lead in the race to supply memory chips for Nvidia Corp. AI accelerators …
Samsung Electronics begins HBM4 shipping for 1st time
Samsung Electronics announced Thursday that it has begun mass production and shipping of high-bandwidth memory 4 (HBM4), marking the world’s first delivery of the advanced chip for artificial intelligence (AI) accelerators to customers. For over a year, the company’s chipmaking Device Solutions division had refrained from officially announcing updates related to its HBM, as its predecessor HBM3E struggled in the market due to yield issues. With …
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