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Samsung Electronics Says It Has Shipped HBM4 Chips to Customers

Samsung's HBM4 offers 46% faster speeds than industry standard and 40% improved power efficiency, aiming to meet surging AI data center demand and expand market share.

  • From Seoul, Samsung said it began mass producing and shipped HBM4 to unnamed customers on Feb 12, 2026.
  • Demand from AI data centers has prompted Samsung to pursue faster, higher-capacity HBM solutions as customers' performance needs rise, with Samsung expecting HBM sales to more than triple in 2026.
  • Samsung said HBM4 achieves a consistent 11.7 Gbps, up to 13 Gbps, boosts 3.3 TB/s bandwidth per stack, offers 24 GB–36 GB via 12-layer stacking, and improves power efficiency by 40%.
  • Samsung Electronics Co., Ltd. shares rose 6.4% on Friday after the HBM4 launch, while rivals signalled ongoing high-volume production and partnership expansion plans.
  • Samsung plans to deliver HBM4E samples in the second half of this year, using advanced 1c DRAM and 4nm logic process to secure stable yields and improve scaling.
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연합뉴스-Yonhap News Agency broke the news in Korea, Republic of on Thursday, February 12, 2026.
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