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New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments
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New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments
The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families CHANDLER, Ariz., March 19, 2026 — Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC® power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The BZPACK modules can deliver exceptional reliability, streamline manufacturing and …
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