Need For KGD Drives Singulated Die Screening

Need For KGD Drives Singulated Die Screening

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly higher than with a single die. Better methods for inspecting and testing these devices are already starting to roll out. High-throughput infrared inspection is capable of catching more sub-surface defects that can cause device failure. And active temper…