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Low Temperature Cu-Cu Bonding for Advanced Packaging (NYCU)
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Low Temperature Cu-Cu Bonding for Advanced Packaging (NYCU)
A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging” was published by researchers at National Yang Ming Chiao Tung University. Abstract “This work investigates the thermal stability of Cu-Cu bonding using a thin Ag passivation layer in applications targeting advanced packaging. Conventional Cu-Cu bonding often requires elevated temperatu…
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