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Kirin 9030 In-Depth Analysis Proves SMIC Can Create Denser SoCs Than Intel Has With Its 18A Node, But The Attributes That Require Improvements Are Left Out
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Kirin 9030 In-Depth Analysis Proves SMIC Can Create Denser SoCs Than Intel Has With Its 18A Node, But The Attributes That Require Improvements Are Left Out
The lack of access to EUV paraphernalia in any way, shape, or form has forced China’s SMIC to come up with ingenious ways to leverage its existing DUV equipment to gradually improve its 7nm manufacturing process, and with Huawei’s Kirin 9030, the semiconductor manufacturer has proven that it can stand ‘toe to toe’ with TSMC, or can it? An in-depth look at the chipset powering the Mate 80 flagship series shows some impressive feats, such as achie…
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