Japan’s Rapidus Says 2nm Chip Tech on Track for 2027
CHITOSE, HOKKAIDO, JAPAN, JUL 18 – Rapidus demonstrated electrical characteristics of 2nm gate-all-around transistors and aims for mass production in 2027 to compete with global semiconductor leaders.
- On July 18, 2025, Rapidus Corporation unveiled successful prototypes of 2-nanometer semiconductor chips at a press event in Chitose, Hokkaido.
- This achievement follows intensive development aided by government funding and partnerships with IBM, and rapid fab construction since Rapidus' 2022 establishment.
- The prototype wafers, made with gate-all-around transistors using EUV lithography, demonstrated electrical characteristics meeting expected performance levels.
- CEO Atsuyoshi Koike described the progress as exceptionally rapid and indicated that clarity regarding potential customers should improve by the close of 2025.
- Rapidus plans to mass-produce 2nm chips by 2027, continuing refinement of transistor performance and production yields throughout 2025 to support this goal.
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Rapidus showcases 2nm chip prototypes, eying 2027 mass production
Rapidus, Japan's leading semiconductor company, unveiled its first set of 2nm prototype chips on July 18 during a press event held in Chitose City, Hokkaido. The unveiling took place at a hotel near the company's pilot production site and drew a crowd of about 200 suppliers and prospective clients.
Rapidus Achieves Significant Milestone at its State-of-the-Art Foundry with Prototyping of Leading-Edge 2nm GAA Transistors
First prototypes successfully demonstrate electrical characteristics as the company continues to hit targets leading up to 2027 mass-production
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