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Japan’s Rapidus Says 2nm Chip Tech on Track for 2027

CHITOSE, HOKKAIDO, JAPAN, JUL 18 – Rapidus demonstrated electrical characteristics of 2nm gate-all-around transistors and aims for mass production in 2027 to compete with global semiconductor leaders.

  • On July 18, 2025, Rapidus Corporation unveiled successful prototypes of 2-nanometer semiconductor chips at a press event in Chitose, Hokkaido.
  • This achievement follows intensive development aided by government funding and partnerships with IBM, and rapid fab construction since Rapidus' 2022 establishment.
  • The prototype wafers, made with gate-all-around transistors using EUV lithography, demonstrated electrical characteristics meeting expected performance levels.
  • CEO Atsuyoshi Koike described the progress as exceptionally rapid and indicated that clarity regarding potential customers should improve by the close of 2025.
  • Rapidus plans to mass-produce 2nm chips by 2027, continuing refinement of transistor performance and production yields throughout 2025 to support this goal.
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PR Newswire broke the news in United States on Friday, July 18, 2025.
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