Huawei Develops 122TB SSD Using Innovative Packaging Amid US Export Controls
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7 Articles
Huawei develops 122TB SSD using innovative packaging amid US export controls
Huawei's innovation in SSD packaging highlights resilience and adaptability, challenging the effectiveness of US export controls on tech advancement. The post Huawei develops 122TB SSD using innovative packaging amid US export controls appeared first on Crypto Briefing.
Huawei uses new packaging tech for high-end SSDs against US ban
Huawei has recently launched new 61.44TB and 122.88TB storage solutions (SSDs) using a special packaging tech. Since the company can’t access the 100+ layer 3D NAND due to the US restrictions, it adopted the Die-on-Board packaging process. Before we proceed with the new storage solutions, let’s understand the new packaging tech. Starting with 3D NAND – it is a manufacturing method that arranges memory cells vertically in multiple layers on a sil…
China wants to become technologically independent from other countries, especially from the United States. This has made life impossible for it if we take into account that it is the one that prevented it from buying advanced chips, causing China to become technologically outdated. But what the United States did not expect is that the Asian giant managed to recover from that coup so fast and in a matter of a few years already has CPU chips, GPU …
Huawei's 122TB SSD Uses New Packaging to Sidestep US 3D NAND Sanctions
Huawei’s 122TB SSD: How New Packaging Helps Bypass US 3D NAND Sanctions Constraints Huawei’s 122TB SSD Uses New Packaging to Sidestep US 3D NAND Sanctions Reports from industry analysts and Chinese tech media suggest that Huawei has developed a massive-capacity enterprise SSD rated at up to 122TB (often cited as 122.88TB). While Huawei has not broadly published full public specifications, the narrative gaining traction is that the company leve…
Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint
Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the limitations of traditional NAND packaging to deliver higher capacity using less dense 3D NAND dies.
Huawei announced the OceanDisk 1800 series of solid-state drives, designed for high-performance data centers and artificial intelligence (AI) workloads. Currently, the lineup includes 61.44 TB and 122.88 TB models, and the developers promise to expand the range with a 245 TB version in the near future. However, the key feature of this new product is not so much its record-breaking capacity as its innovative approach... The post Huawei Makes a Br…
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