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£9 million funding boost to bring key semiconductor manufacturing capability to Scotland

Summary by Industrial News
New development could cut chip packaging process from months to just days for UK firms A new R&D development designed to support the growth of semiconductor packaging has received a £9 million funding injection, helping to reshore a critical part of the UK’s £500 million electrification supply chain and create new opportunities for manufacturers to access new markets and cut costs. Hosted by the National Manufacturing Institute Scotland (NMIS), …
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Industrial News broke the news in on Friday, March 21, 2025.
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