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Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D

Summary by Semiconductor Digest
Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state.
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Semiconductor DigestSemiconductor Digest

Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D

Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state.

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Semiconductor Digest broke the news on Tuesday, November 10, 2026.
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