US EditionE&R Showcases Advanced Packaging Innovations at IEEE ECTC 2025 in Texas
- E&R Engineering Corp. Will present its latest advanced packaging innovations at the 75th IEEE ECTC from May 27-30, 2025, in Texas.
- This participation follows E&R’s effort to demonstrate its high-precision laser drilling, multi-beam laser applications, and plasma systems with uniformity and thermal stability.
- The company plans to present its all-encompassing Flip Chip solution, which includes pre-die bonding and plasma cleaning before underfill, along with laser marking on boats or trays to ensure reliable traceability.
- Kevin Chang, who leads marketing, alongside Leo Lee, the sales team supervisor, both bringing significant North American market expertise, will connect with partners at Scientech’s booth located at 1501 Gaylord Trail in Grapevine, Texas.
- E&R’s presence suggests a strategic focus on strengthening semiconductor packaging technologies and expanding market connections in North America.
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Denton Record-Chronicle+13 Reposted by 13 other sources
E&R Showcases Advanced Packaging Innovations at IEEE ECTC 2025 in Texas
KAOHSIUNG, May 12, 2025 /PRNewswire/ -- E&R Engineering Corp. is excited to participate in the 75th IEEE Electronic Components and Technology Conference (ECTC), taking place from May 27–30, 2025 at the Gaylord Texan Resort & Convention Center in Texas.
·Denton, United States
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