US EditionCo-Design Optimization For PI/SI When Considering Thermal Performance
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Co-Design Optimization For PI/SI When Considering Thermal Performance
When applications become more complex, higher data rates or high frequencies are required. However, with increasing functions, more power dissipation will be generated. Furthermore, temperature is proportional to power dissipation, so electrical performance will also depend on thermal conditions. To determine how temperature impacts power integrity/signal integrity (PI/SI), electrical simulations including package design and printed circuit boar…
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