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China's Synthetic Diamond Finds Its Biggest Opportunity Yet: Cooling AI Chips

Summary by Pandaily
The AI chip industry is hitting a thermal wall. High-end processors now exceed 1,000W thermal design power, with some third-generation semiconductor devices reaching heat flux densities over 500W per square centimeter. To put this in perspective, a chip's heat density can surpass that of a rocket engine nozzle. Without adequate cooling, every 10 degrees Celsius increase in temperature reduces chip performance by 3 to 5 percent and cuts operation…
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Pandaily broke the news on Tuesday, June 23, 2026.
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