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Cadence Partners with TSMC for Advanced AI, Chip Design
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Cadence Partners with TSMC for Advanced AI, Chip Design
Cadence Design Systems has announced a collaboration with TSMC to develop AI-driven design solutions and IP for advanced process nodes and 3D-IC packaging. The partnership aims to speed up chip development for AI and high-performance computing (HPC) applications. The announcement highlighted that Cadence’s AI design flows now support TSMC’s N2 and A16 technologies, while new silicon-proven IP is available for TSMC N3P. Both companies will also w…
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