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Backside Power Delivery Nears Production

Summary by Semiconductor Engineering
Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower voltage droop, and reduced power supply noise. And it is poised to deliver these benefits below the 2nm node, despite a substantial disruption in front-end processes from lithography pattern distortion caused by extreme wafer thinning, wafer bonding,…
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Semiconductor Engineering broke the news in on Thursday, April 17, 2025.
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