ASU to host state-of-the-art CHIPS for America R&D facility

Arizona State gets third national chip lab to focus on prototyping

Arizona State was awarded an undisclosed amount of money to build the third National Semiconductor Technology Center lab in the U.S., complementing the chip-patterning lab awarded to Albany NanoTech.

ASU selected as home, partner for CHIPS - Electronic Products & Technology

Arizona State University in Tempe Arizona has been selected as the home and partner for CHIPS and science act-funded national facility for semiconductor advanced packaging in the U.S. The U.S. Commerce Department and Natcast — the operator of the National Semiconductor Technology Center (NSTC) announced the selection of Arizona as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. Researchers work inside …

ASU to host state-of-the-art CHIPS for America R&D facility

Arizona State University was selected to host the third of three cutting-edge CHIPS for America Research and Development facilities at Research Park in Tempe.

Third Flagship CHIPS for America R&D Facility Site Revealed

The Department of Commerce and the National Center for the Advancement of Semiconductor Technology, or Natcast, has revealed the possible location of the third CHIPS for America flagship research and development facility. The department said Monday the Arizona State University Research Park in Tempe, Arizona is the potential site for the National Semiconductor Technology Center’s Prototyping and National Advanced Packaging Manufacturing Program—…

ASU chosen as site for semiconductor facility - Rose Law Group Reporter

By Amy Edelen | Phoenix Business Journal Arizona’s semiconductor industry just got another boost. The U.S. Department of Commerce and Natcast announced Monday that Arizona will be home to the country’s third flagship CHIPS for America research and development facility, underscoring the state’s growing role in the national semiconductor industry. The NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility will operate at 8240 S. River Par…

US completes chip R&D trio with Arizona 300mm centre

Arizona is to host what the US says is the world’s first 300mm front-end semiconductor manufacturing and advanced packaging research facility The US Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third and final flagship CHIPS for America research and development […] The post US completes chip R&D trio with Arizona 300mm centre appeared first on …