Arizona State University was selected to host the third of three cutting-edge CHIPS for America Research and Development facilities at Research Park in Tempe.

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ASU to host state-of-the-art CHIPS for America R&D facility

Arizona State was awarded an undisclosed amount of money to build the third National Semiconductor Technology Center lab in the U.S., complementing the chip-patterning lab awarded to Albany NanoTech.

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Arizona State gets third national chip lab to focus on prototyping

Tegna Inc.

Tegna Inc

Photo from ASU One hopes that in two and four years time, Arizona Democratic Leaders across the state, from local district to Representative to Senator to statewide officeholders will campaign on how they (without hardly any Republican support,) along with their partners in the Biden/Harris Administration brought future forward infrastructure, semiconductor, and clean energy industries…

Blog for Arizona

Read Another Parting Gift from the Biden/Harris Administration to Arizona: A  CHIPS R&D Facility for the ASU Research Park now from Blog for Arizona for Politics from a Liberal Viewpoint

The Arizona Commerce Authority announced that the U.S. Commerce Department and Natcast, the operator of the National Semiconductor Technology Center (NSTC), have selected Arizona as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility, the third of three CHIPS for America research and development (R&D) flagship facilities. The facility will combine…

Greater Phoenix In Business Magazine

Arizona and ASU Selected for Flagship Prototyping and Advanced Packaging R&D Facility - Greater Phoenix In Business Magazine

Arizona State University in Tempe Arizona has been selected as the home and partner for CHIPS and science act-funded national facility for semiconductor advanced packaging in the U.S. The U.S. Commerce Department and Natcast — the operator of the National Semiconductor Technology Center (NSTC) announced the selection of Arizona as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. Researchers work inside …

Electronic Products & Technology

ASU selected as home, partner for CHIPS - Electronic Products & Technology

Arizona is to host what the US says is the world’s first 300mm front-end semiconductor manufacturing and advanced packaging research facility The US Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third and final flagship CHIPS for America research and development […] The post US completes chip R&D trio with Arizona 300mm centre appeared first on …

eeNews Europe

US completes chip R&D trio with Arizona 300mm centre

By Amy Edelen | Phoenix Business Journal Arizona’s semiconductor industry just got another boost. The U.S. Department of Commerce and Natcast announced Monday that Arizona will be home to the country’s third flagship CHIPS for America research and development facility, underscoring the state’s growing role in the national semiconductor industry. The NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility will operate at 8240 S. River Par…

Rose Law Group Reporter

ASU chosen as site for semiconductor facility - Rose Law Group Reporter

The Department of Commerce and the National Center for the Advancement of Semiconductor Technology, or Natcast, has revealed the possible location of the third CHIPS for America flagship research and development facility. The department said Monday the Arizona State University Research Park in Tempe, Arizona is the potential site for the National Semiconductor Technology Center’s Prototyping and National Advanced Packaging Manufacturing Program—…

Executive Gov

Third Flagship CHIPS for America R&D Facility Site Revealed

Facility is expected to host the world’s first 300mm front-end semiconductor manufacturing and advanced packaging research facility.

Semiconductor Digest

ASU Research Park Named as Planned Site for Third CHIPS for America R&D Flagship Facility - Semiconductor Digest

“On behalf of NY CREATES, I would like to extend our congratulations to Arizona State University on being selected as the anticipated location for the CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility, an NSTC and NAPMP facility. We welcome ASU as a critical peer supporting the NSTC’s mission, as NY CREATES hosts the CHIPS for America EUV Accelerator, a flagship …

ASU to host state-of-the-art CHIPS for America R&D facility

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