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Participating in “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging
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Participating in “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging
WESTFORD, MA, USA, September 4, 2025 – Zuken Inc. (President: Katsube Jinya, hereinafter “Zuken”) has joined “JOINT3” consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic inte…
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