High-NA EUV Photomask Push Targets 12-Inch Mask Pilot Line
ASML and TSMC said 12-inch masks could boost scanner productivity and help the industry support smaller, faster chips.
8 Articles
8 Articles
ASML targets 2033 for High-NA EUV with larger masks, promising a 40% productivity gain
High-NA EUV is ASML's next major lithography platform. It can print finer features than today's EUV tools, which could help chipmakers build denser designs at advanced nodes. But its smaller mask limits the die area that can be printed in one exposure.Read Entire Article
ASML, TSMC Join Hands for 12-inch Photomasks, Target Pilot Line by 2031 for Next-gen Chipmaking
Get latest articles and stories on Business at LatestLY. Semiconductor equipment major ASML and Taiwan Semiconductor Manufacturing Company (TSMC) have joined hands on an industry-wide initiative to drive the transition to 12-inch photomasks, with the companies targeting a pilot line by 2031 to support the next generation of advanced chip manufacturing. Business News | ASML, TSMC Join Hands for 12-inch Photomasks, Target Pilot Line by 2031 for Ne…
To increase productivity Chipmakers TSMC, Samsung and Intel have now agreed to scrap a decades-old standard in favor of a standard that will make it possible to make chips with twice the size of photomasks, the "templates" used to draw patterns on silicon wafers. The change comes as companies can better utilize chipmaker ASML's new so-called High-NA EUV machines, machines that can draw extremely finer patterns than previous EUV machines. The r…
ASML and TSMC drive an initiative to carry 6-12 inch photo masks and leverage High NA EUV in manufacturing ever-larger AI chips.
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