ASML Inks Advanced EUV Lithography Deals With Chip Titans TSMC, Samsung
TSMC and Samsung will adopt ASML’s high-NA systems as the company says the tools could lift throughput by 40%, according to ASML.
- On Tuesday, ASML announced that Samsung and TSMC agreed to adopt its high-NA EUV lithography machines for manufacturing by 2028 and 2030, respectively.
- High-NA technology prints smaller features with more precision than Low-NA, allowing chipmakers to fit more transistors on each semiconductor and increase processing power.
- ASML, Intel, Samsung, and TSMC also agreed Tuesday to double photomask size from 6 inches to 12 inches, aiming to boost production efficiency and reduce costs as AI demand surges.
- ASML shares rose 2.91% in New York on Tuesday, with Barclays analysts calling the announcement a "positive" for High-NA revenue growth and Wall Street projecting 40% upside.
- While China races to develop EUV machines, Zeiss Group executives recently predicted the country needs 15 years to catch up, as UBS analysts noted China remains years behind ASML's technology.
14 Articles
14 Articles
Industry Adopts ASML’s $400M High-NA EUV Systems, Ditching Multi-Patterning
The semiconductor industry has agreed to adopt ASML’s $400 million high-NA EUV lithography systems, shifting from multi-patterning to single-pass direct patterning for advanced nodes. Samsung, TSMC, and Intel are leading the coordinated transition, promising simplified processes, better yields, and faster production despite high costs and infrastructure demands.
Taiwan Semiconductor Manufacturing Co. (TSMC) announced on Tuesday that it will start using, from 2030, the world's most advanced chip manufacturing equipment, produced by ASML. Samsung Electronics plans to adopt it already in 2028, and Intel has informed that it is already making mass production with the new machine. Exclusive material for subscribers. To have full access, access the material link and register.
Ars Technica
Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change
Chipmaking changes could boost productivity of new ASML machines by 40 percent.
TSMC To Use ASML Photolithography Gear For Next-Gen Chips
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