Xiaomi takes aim at MediaTek with 3nm XRing O1 breakthrough
- Xiaomi launched its flagship Xring O1 chip in 2025, powering the Xiaomi 15S Pro smartphone and Pad 7 Ultra tablet in China.
- This launch follows a decade of Xiaomi’s strategic investment in developing proprietary silicon to reduce reliance on Qualcomm and MediaTek.
- Built on TSMC’s second-generation 3nm node, the Xring O1 features a 10-core Arm v9.2 CPU with two 3.9GHz Cortex-X925 cores, a 16-core Immortalis-G925 GPU, and a 6-core NPU delivering 44 TOPS.
- Xiaomi’s Xring O1 chipset achieved a benchmark result exceeding 3 million points on AnTuTu, outperforming the Snapdragon 8 Elite; however, it currently uses an external MediaTek modem, which impacts its power consumption.
- Xiaomi’s chip debut marks a significant step toward becoming a major chipmaker and could pressure established suppliers if modem integration improves and performance remains competitive.
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Xiaomi takes aim at MediaTek with 3nm XRing O1 breakthrough
Xiaomi's launch of the XRing O1 at its "New Starting Point" event in Beijing marked more than just a new chip release—it was a direct challenge to industry giants Apple, Qualcomm, and MediaTek. Backed by over CNY13.5 billion (approx. US$1.87 billion) in R&D across four years, the XRing O1 is Xiaomi's first successful flagship SoC since the ill-fated Surge S1, signaling a serious shift in the company's silicon ambitions, as and report.
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