US EditionTRI and Bosch Partner on AI Solution for MEMS Packaging
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TRI and Bosch Partner on AI Solution for MEMS Packaging
[May 26, 2025 – Taipei, Taiwan] Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging. Bosch has recognized TRI’s valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the …
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