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Thundercomm Unveils TurboX C6690 SOM at Embedded World 2025: AI-Ready Ultra-Compact Module for Industrial Handheld Applications

Thundercomm announced the TurboX C6690 SOM at Embedded World 2025, designed for industrial handheld devices and edge computing applications.
The TurboX C6690 SOM features Qualcomm's QCS6690 chipset, delivering 6 TOPS AI performance for on-device AI applications.
Pier Zhang, vice president of Thundercomm, stated that the TurboX C6690 SOM supports digital transformation in industries like retail and logistics by offering a compact, AI-ready solution.
The TurboX C6690 SOM supports 4K video capabilities and modular feature packages, enabling diverse applications while improving production efficiency.

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Charleston Gazette-Mail

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Thundercomm Unveils TurboX C6690 SOM at Embedded World 2025: AI-Ready Ultra-Compact Module for Industrial Handheld Applications

NUREMBERG, Germany, March 11, 2025 /PRNewswire/ -- At Embedded World 2025, Thundercomm, a world-leading IoT solutions provider, announced the release of its new TurboX C6690 SOM (System-on-Module). Built on Qualcomm's 4nm-process QCS6690 chipset platform, the SOM is engineered for industrial…

13 hours ago·Charleston, United States

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candicerodriguez.com

Thundercomm Unveils TurboX C6690 SOM at Embedded World 2025 – Morningstar

Built on Qualcomm's 4nm-process QCS6690 chipset platform, the SOM is engineered for industrial handheld devices, industrial tablets, edge computing ...http://dlvr.it/TJTQbt

4 hours ago

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