Broadcom-Toppan Venture Opens Singapore's First High-End FC-BGA Substrate Plant

Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant

Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026, the first in the country capable of producing high-end flip chip ball grid array (FC-BGA) substrates. The approximately 95,000-square-meter plant in the Jurong Lake District is the Toppan Group's first such facility outside Japan and is targeting the start of high-valu…

Singapore’s first advanced semiconductor materials plant opens

Singapore's first advanced semiconductor plant produces FC-BGA substrates to meet growing AI demand and strengthen the global semiconductor supply chain. Read more at straitstimes.com.

Broadcom and TOPPAN JV opens FC-BGA substrate plant in Singapore

Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

AST opens Singapore advanced substrate factory

AST has opened Singapore's first high-end FC-BGA substrate manufacturing plant. The 95,000m² facility adds semiconductor packaging capacity for AI and networking hardware.

Japan’s TOPPAN, US’ Broadcom open Singapore’s first high-end AI-chip substrate plant

A joint venture between Japan's TOPPAN and U.S. chipmaker Broadcom opened Singapore's first plant for high-end FC-BGA chip substrates on Tuesday, a component in short supply as demand for AI processors surges.

Broadcom-Toppan JV opens “first” substrate plant in Singapore

Advanced Substrate Technologies (AST), a joint venture between US chipmaker Broadcom and Japan’s Toppan Holdings, has opened a substrate manufacturing plant in Singapore.