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Samsung to Replace Silicon with Glass in AI Chip Packaging by 2028

Summary by TechJuice
Samsung Electronics is preparing to replace traditional silicon interposers with glass substrates in chip packaging by 2028. This move, recently confirmed through the company’s official roadmap, signals a turning point in AI chip innovation and manufacturing efficiency. The switch to glass interposers offers multiple advantages over current silicon-based options, especially for 2.5D chip packaging used in AI semiconductors. Interposers play a ke…
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Wccftech broke the news in on Sunday, May 25, 2025.
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