Qualcomm Validates HBC Silicon, Samples Appear in First Half of 2027

Qualcomm Takes On The AI Inference Memory Bottleneck With Working HBC Silicon, And Its First Data Center Product Is Already Taped Out

Qualcomm has announced that its first-generation High Bandwidth Compute (HBC) silicon has been validated in its San Diego lab, giving the company early hardware evidence for a memory design aimed at AI inference. The chip seemingly ran the complete memory read-write path and near-memory computations at production-representative dimensions, using industry-standard automated test equipment with randomized weights and activations. The chipset maker…

Qualcomm Has Eyes On The AI Inference Datacenter With HBC And AI250

Qualcomm executives this summer introduced an architecture called high-bandwidth computing (HBC), th ...

Qualcomm Validates HBC Silicon, Samples Appear in First Half of 2027

Qualcomm has officially validated its High Bandwidth Compute (HBC) concept, which the company showcased this summer. Instead of using traditional HBM and compute dies, Qualcomm has developed a technology that stacks multiple LPDDR layers and embeds a base die that serves as a compute engine for AI inference. In Qualcomm's San Diego lab, the first-generation HBC has achieved silicon validation with full read-write and near-memory computation capa…

Qualcomm Validates HBC Stacked Memory Ahead of 2027 Dragonfly AI250 Sampling

Qualcomm today is announcing that they have completed initial validation on their High Bandwidth Compute technology. The DRAM-stacked-upon-compute architecture moves on to commercialization, with Dragonfly AI250 set to sample in the first half of 2027