NVIDIA and Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

NVIDIA Lines Up Six Suppliers to Expand Substrate, Packaging, Testing and Optics Capacity

NVIDIA said Oct. 21 that IBIDEN, Samsung Electro-Mechanics, Unimicron, Amkor, KYEC and SPIL will expand substrate, packaging, test and optical-engine capacity, with most targets landing in 2027 and 2028.

NVIDIA and Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

New Capacity Agreements and Manufacturing Facilities to Support Volume Growth and Strengthen Supply Chain Resiliency

NVIDIA and Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout - PressReach

News Summary: Substrate agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron Technology Corporation will, in aggregate, drive a 2.5x increase in capacity over the next three years. Amkor plans to increase its advanced packaging capacity by more than 300% by the end of 2028. KYEC will build new facilities in the U.S., supported by a $1.1 … Continue reading "NVIDIA and Supply Chain Partners Expand Capacity to Accelerate AI Infrastructur…

Nvidia and Amkor plan over 300% jump in advanced packaging capacity

The expansion in packaging capacity highlights the critical role of infrastructure scaling in meeting surging AI demand and global supply chain shifts.

Amkor Technology and NVIDIA Advance Strategic Partnership for AI Infrastructure

TEMPE, Ariz.--(BUSINESS WIRE)---- $AMKR #AI--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor packaging and test services, today announced additional investments in South Korea for capacity expansion initiatives with NVIDIA. With this latest commitment, Amkor’s multi-year agreements with NVIDIA in Arizona and South Korea total $3 billion. The initiatives support growing demand for next-generation AI and accel…